Parametric FEA thermal model for QFP packages

Author

Lall, Balwant S. ; Guenin, Bruce M. ; Marrs, Robert C. ; Molnar, Ronald J.

Author_Institution

Adv. Products Oper., Amkor Electron. Inc., Chandler, AZ, USA

fYear

1996

fDate

5-7 Mar 1996

Firstpage

105

Lastpage

110

Abstract

Computer models are used with increasing frequency in the industry to predict package thermal performance. To reduce calculation times to acceptable levels, simplifications are often made in one or more of the following three areas: 1) package geometry, 2) printed circuit board (PCB) or 3) heat transfer to the ambient. This paper provides guidelines for implementing simplifications in each of these three areas in the area of a single QFP package attached to a board and evaluates their accuracy by comparing the results of the simplified models either with appropriate FEA computer models or experimental measurements

Keywords

cooling; finite element analysis; heat transfer; integrated circuit modelling; integrated circuit packaging; plastic packaging; thermal analysis; FEA computer models; PCB; QFP packages; heat transfer; package geometry; package thermal performance; parametric FEA thermal model; Area measurement; Computer industry; Electronic packaging thermal management; Electronics packaging; Frequency; Geometry; Heat transfer; Predictive models; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Conference_Location

Austin, TX

ISSN

1065-2221

Print_ISBN

0-7803-3139-7

Type

conf

DOI

10.1109/STHERM.1996.545099

Filename

545099