DocumentCode
2147779
Title
Reducing PCB solder process defects and improving PCB solder joint reliability through computer simulation
Author
Park, Hark Byeong ; Hong, Soon Kug ; Tomasek, Rob
Author_Institution
Manuf. Technol. Center, LG Electron. Inc., South Korea
fYear
1996
fDate
5-7 Mar 1996
Firstpage
122
Lastpage
128
Abstract
One of the greatest problems facing electronics companies today is the difficulty of successfully transitioning from design to manufacturing. This problem is primarily the result of the combined effect of higher density printed circuit boards, an increase in the functional reliability of both components and assemblies, and an overall miniaturization of products and circuit boards. Additional requirements, such as mass production capabilities and lowering unit costs, require manufacturers to autosolder components onto printed circuit boards and significantly reduce the amount of hand or manual soldering. The design and manufacture of assemblies, which operate reliably at today´s complexities, require unique capabilities to validate the design before manufacturing can begin. Computer simulation of circuit designs and manufacturing processes is much less expensive than prototyping. Simulation can uncover design errors before prototyping begins through highly accurate numerical analysis
Keywords
circuit analysis computing; circuit reliability; digital simulation; economics; printed circuit manufacture; soldering; thermal analysis; PCB solder process; autosoldering; circuit designs; computer simulation; functional reliability; mass production capabilities; numerical analysis; process defects; solder joint reliability; unit costs; Assembly; Circuit synthesis; Computational modeling; Computer simulation; Costs; Manufacturing processes; Mass production; Printed circuits; Soldering; Virtual prototyping;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location
Austin, TX
ISSN
1065-2221
Print_ISBN
0-7803-3139-7
Type
conf
DOI
10.1109/STHERM.1996.545101
Filename
545101
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