• DocumentCode
    2147779
  • Title

    Reducing PCB solder process defects and improving PCB solder joint reliability through computer simulation

  • Author

    Park, Hark Byeong ; Hong, Soon Kug ; Tomasek, Rob

  • Author_Institution
    Manuf. Technol. Center, LG Electron. Inc., South Korea
  • fYear
    1996
  • fDate
    5-7 Mar 1996
  • Firstpage
    122
  • Lastpage
    128
  • Abstract
    One of the greatest problems facing electronics companies today is the difficulty of successfully transitioning from design to manufacturing. This problem is primarily the result of the combined effect of higher density printed circuit boards, an increase in the functional reliability of both components and assemblies, and an overall miniaturization of products and circuit boards. Additional requirements, such as mass production capabilities and lowering unit costs, require manufacturers to autosolder components onto printed circuit boards and significantly reduce the amount of hand or manual soldering. The design and manufacture of assemblies, which operate reliably at today´s complexities, require unique capabilities to validate the design before manufacturing can begin. Computer simulation of circuit designs and manufacturing processes is much less expensive than prototyping. Simulation can uncover design errors before prototyping begins through highly accurate numerical analysis
  • Keywords
    circuit analysis computing; circuit reliability; digital simulation; economics; printed circuit manufacture; soldering; thermal analysis; PCB solder process; autosoldering; circuit designs; computer simulation; functional reliability; mass production capabilities; numerical analysis; process defects; solder joint reliability; unit costs; Assembly; Circuit synthesis; Computational modeling; Computer simulation; Costs; Manufacturing processes; Mass production; Printed circuits; Soldering; Virtual prototyping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-3139-7
  • Type

    conf

  • DOI
    10.1109/STHERM.1996.545101
  • Filename
    545101