Title :
Development of JEDEC standard thermal measurement test boards
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A combination of experimental and modeling studies has been performed to define the impact of printed circuit board (PCB) design on the measured thermal performance of IC packages. These results have been used to develop a JEDEC test card standard that allows less than 10% measurement variability between the minimum and maximum limits of the design parameters. At the same time, the standard allows wide latitude in layout for various components. The modelling and measurement studies that were performed to set the limits of the standard test coupons for surface mounted components and area array packages such as ball grid arrays (BGAs) will be described, along with extensions in principle to actual devices operating in systems
Keywords :
integrated circuit measurement; integrated circuit packaging; measurement standards; printed circuit testing; surface mount technology; thermal variables measurement; IC package; JEDEC standard thermal measurement test board; PCB design; ball grid array; surface mounted component; Area measurement; Circuit testing; Electronics packaging; Integrated circuit modeling; Integrated circuit packaging; Measurement standards; Performance evaluation; Printed circuits; Standards development; System testing;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545108
