An Efficient Resonant Microstrip Feed-Through for Ceramic Package Interconnect at Millimeter Wave Frequencies

An efficient resonant microstrip feed-through1 is presented for ceramic package design at milimeter wave frequencies. A scaled model is built at one tenth of the frequency and measured for comparison with a 3D field solver. Good agreement between the scaled model and the corresponding simulation is obtained with 20% bandwidth (R.L. > 20 dB) around 2.5 GHz. The transition integrated to a simple package with some comprehensive 3D simulation is presented. Simulated return loss is better than 35 dB at center frequency and 15% bandwidth (R.L. > 20 dB) can be achieved. A simplified equivalent circuit is also presented with some variations on the transition.