Title :
Millimeter-Wave Flip-Chip Front-End IC and Power Amplifier Using MBB Technology
Author :
Maeda, Masahiro ; Sakai, Hiroyuki
Author_Institution :
Electronics Research Laboratory, Matsushita Electronics Corporation, E-mail: maeda@oerl.src.mei.co.jp
Abstract :
This paper describes concepts and performance of millimeter-wave flip-chip IC and power amplifier using MBB (Micro Bump Bonding) technology. Two types of flip-chip technologies, MFIC (Millimeter-wave Flip-chip IC) and MBS (Micro Bump on Source electrode) technologies are introduced, and their applications to a K-band receiver front-end IC and a K-band power amplifier are presented.
Keywords :
Bonding; Costs; Dielectric losses; Electrodes; Insertion loss; MMICs; Millimeter wave technology; Power amplifiers; Resins; Substrates;
Conference_Titel :
Microwave Conference, 1999. 29th European
Conference_Location :
Munich, Germany
DOI :
10.1109/EUMA.1999.338361
