The study on the thermal behavior of packaged power LEDs

Author

Zhang, Guangchen ; Feng, Shiwei ; Wang, Lu ; Xie, Xuesong ; Gao, Lichao ; Meng, Haijie

Author_Institution

Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China

fYear

2008

fDate

20-23 Oct. 2008

Firstpage

1211

Lastpage

1214

Abstract

The reliability of power LEDs has strong dependence on successful package thermal management. In this paper, heating response curves of LEDs were recorded by the temperature sensitive parameter (TSP) method and fast-switching circuit techniques. It provided a novel method to analyze thermal resistance composition of power LEDÂ¿s packaging. Cover-and-block method was presented to provide a correction to the apparent thermal resistance of optical devices, and an electrical method to obtain radiant efficiency was also put forward.

Keywords

light emitting diodes; reliability; thermal management (packaging); thermal resistance; cover-and-block method; fast-switching circuit techniques; heating response curves; packaged power LED; temperature sensitive parameter method; thermal management; thermal resistance composition; Circuits; Electric resistance; Energy management; Heating; Light emitting diodes; Optical devices; Packaging; Temperature sensors; Thermal management; Thermal resistance; packaged power LED; radiant efficiency; reliability; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-2185-5

Electronic_ISBN

978-1-4244-2186-2

Type

conf

DOI

10.1109/ICSICT.2008.4734765

Filename

4734765