DocumentCode
2149020
Title
Study on electrical properties of HfTiON and HfTiO gate dielectric Ge MOS capacitors with wet-NO surface pretreatment
Author
Zou, Xiao ; Xu, Ling-Ping
Author_Institution
Sch. of Electromachine&Archit. Eng., Jianghan Univ., Wuhan, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
1280
Lastpage
1283
Abstract
Reactive co-sputtering is employed to prepare HfTiO/GeOxNy and HfTiON/GeOxNy stack gate dielectrics by using wet NO or N2O surface pretreatment. The experimental results show that the wet NO pretreatment can lead to excellent interface properties, gate leakage properties and device reliability, especially for HfTiON/GeOxNy stack gate dielectrics. The involved mechanisms lie in N-barrier role and suitable N incorporation in GeOxNy interlayer, effectively preventing further increase of GeOxNy interlayer and the growth of unstable GeOx during subsequent processing.
Keywords
MIS capacitors; germanium compounds; hafnium compounds; semiconductor device reliability; semiconductor growth; surface treatment; titanium compounds; HfTiON-GeOxNy; MOS capacitors; N2O; device reliability; gate leakage properties; stack gate dielectric; wet-NO surface pretreatment; Annealing; Dielectric substrates; Gate leakage; Hafnium; High K dielectric materials; High-K gate dielectrics; Leakage current; MOS capacitors; MOSFETs; Passivation;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734775
Filename
4734775
Link To Document