Title :
Reliability tests for discriminating between technological variants of QFN packaging
Author :
Bazu, M. ; Ilian, V.E. ; Varsescu, D. ; Galateanu, Lucian ; Sikio, Vili ; Reimets, Meelis ; Uhl, Volker ; Weiss, Michael
Author_Institution :
Nat. Inst. for R&D in Microtechnologies, IMT-Bucharest, Bucharest, Romania
Abstract :
A procedure of reliability testing for discriminating between various technological variants is described. This procedure is used for choosing the most reliable variant of QFN packaging, the competitors being the conventional oven curing against three variants of microwave curing. The results, based on failure analysis and statistical processing of data, clearly show that the best choice is one of the variants of microwave curing.
Keywords :
curing; electron device testing; electronics packaging; failure analysis; QFN packaging; competitors; conventional oven curing; failure analysis; microwave curing; reliability testing; statistical data processing; Curing; Failure analysis; Humidity; Microwave integrated circuits; Microwave ovens; Reliability;
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location :
Bucharest
DOI :
10.1109/ESSDERC.2013.6818860
