DocumentCode
2149166
Title
NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs
Author
Lee, Yu-Min ; Wu, Tsung-Heng ; Huang, Pei-Yu ; Yang, Chi-Ping
Author_Institution
National Chiao Tung University, Taiwan
fYear
2013
fDate
18-22 March 2013
Firstpage
1379
Lastpage
1384
Abstract
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
Keywords
Conductivity; Integrated circuit modeling; Temperature distribution; Thermal analysis; Thermal conductivity; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location
Grenoble, France
ISSN
1530-1591
Print_ISBN
978-1-4673-5071-6
Type
conf
DOI
10.7873/DATE.2013.282
Filename
6513728
Link To Document