• DocumentCode
    2149411
  • Title

    Single Event Effect and Total Ionizing Dose Results of Highly Scaled Flash Memories

  • Author

    Irom, Farokh ; Nguyen, Duc N. ; Allen, G.R.

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2013
  • fDate
    8-12 July 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    SEE measurements and TID response for 25-32 nm Micron Technology NAND flash memories are reported. Radiation results of SLC parts are compared with results from MLC and TLC parts. The TLC device showed a very poor response to TID at low dose levels.
  • Keywords
    NAND circuits; flash memories; radiation hardening (electronics); space vehicle electronics; MLC parts; SEE measurements; SLC parts; TID response; TLC device; highly scaled flash memory; low dose levels; micron technology NAND flash memories; single event effect; size 25 nm to 32 nm; total ionizing dose; Computer architecture; Flash memories; Microprocessors; Radiation effects; Single event upsets; Temperature measurement; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation Effects Data Workshop (REDW), 2013 IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    2154-0519
  • Print_ISBN
    978-1-4799-1136-3
  • Type

    conf

  • DOI
    10.1109/REDW.2013.6658209
  • Filename
    6658209