DocumentCode :
2149786
Title :
Reduction of momentum and spin relaxation rate in strained thin silicon films
Author :
Osintsev, Dmitri ; Sverdlov, Viktor ; Selberherr, Siegfried
Author_Institution :
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear :
2013
fDate :
16-20 Sept. 2013
Firstpage :
334
Lastpage :
337
Abstract :
We investigate the surface roughness and phonon induced spin and momentum relaxation in ultra-scaled SOI MOSFETs. We show that the spin-flip hot spots characterized by strong spin relaxation can be efficiently removed by applying shear strain resulting in an increase of spin lifetime by orders of magnitude. In contrast, the momentum relaxation time in ultrathin films, which is mostly determined by surface roughness scattering can be only increased by a factor of two, in agreement with strain-induced mobility enhancement data.
Keywords :
MOSFET; carrier mobility; elemental semiconductors; phonons; semiconductor thin films; shear strength; silicon; silicon-on-insulator; surface roughness; surface scattering; Si; momentum reduction; momentum relaxation; momentum relaxation time; phonon induced spin; shear strain; spin lifetime; spin-flip hot spots; strain-induced mobility enhancement data; strained thin silicon films; strong spin relaxation rate; surface roughness scattering; ultrascaled SOI MOSFET; Films; Phonons; Rough surfaces; Scattering; Silicon; Strain; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ESSDERC.2013.6818886
Filename :
6818886
Link To Document :
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