Title :
Package Effects Caused by Leaky Modes at Higher Frequencies in Microwave Integrated Circuits
Author :
Oliner, Arthur A.
Author_Institution :
Department of Electrical Engineering, Polytechnic University, Brooklyn, NY, USA
Abstract :
When a microwave integrated circuit is placed in a package, the leakage properties of the transmission lines can change significantly, and these package effects may produce new physical behavior or simply cause leakage to occur at a lower frequency than one would expect.
Keywords :
Coplanar waveguides; Crosstalk; Dispersion; Distributed parameter circuits; Frequency; Integrated circuit packaging; Leaky wave antennas; Microstrip; Microwave integrated circuits; Power transmission lines;
Conference_Titel :
Microwave Conference, 1999. 29th European
Conference_Location :
Munich, Germany
DOI :
10.1109/EUMA.1999.338543
