• DocumentCode
    2150611
  • Title

    Ultra-miniature monolithic FBAR filters for wireless applications

  • Author

    Shim, Dongha ; Park, Yunkwon ; Nam, Kuangwoo ; Yun, Seokchul ; Kim, Duckhwan ; Ha, Byeoungju ; Song, Insang

  • Author_Institution
    Samsung Adv. Inst. of Technol., Suwon, South Korea
  • fYear
    2005
  • fDate
    12-17 June 2005
  • Abstract
    This paper presents ultra-miniature monolithic transmit (Tx) filters for 1900 MHz PCS using thin film bulk acoustic resonators (FBAR) technology. Conventional FBAR filters often include multiple tuning inductors, which have prevented the miniaturization and the monolithic integration of the filters. However, the developed filter has a novel circuit configuration using a single integrated inductor to minimize the size. The FBAR block consists of seven FBARs electrically coupled in a ladder topology. A meander type inductor is used for simplicity of fabrication processes and is optimized to increase the receive (Rx) band rejection performance. The filters are hermetically packaged at a wafer-level, which enables us to achieve a size of 1.0 mm × 1.0 mm × 0.7 mm. The packaged filters showed high performance with insertion loss less than 3.3 dB and Rx band rejection over 35 dB.
  • Keywords
    UHF filters; acoustic resonator filters; band-stop filters; bulk acoustic wave devices; hermetic seals; network topology; thin film inductors; 0.7 mm; 1.0 mm; 1900 MHz; FBAR filters; FBAR technology; acoustic resonator filters; band rejection; bandpass filters; bulk acoustic wave devices; hermetic packaging; insertion loss; ladder topology; meander type inductor; monolithic integration; single integrated inductor; thin film bulk acoustic resonators; thin film inductors; ultra-miniature monolithic filters; wafer-level; wafer-scale integration; Circuit optimization; Film bulk acoustic resonators; Integrated circuit technology; Monolithic integrated circuits; Packaging; Personal communication networks; Resonator filters; Thin film circuits; Thin film inductors; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2005 IEEE MTT-S International
  • ISSN
    01490-645X
  • Print_ISBN
    0-7803-8845-3
  • Type

    conf

  • DOI
    10.1109/MWSYM.2005.1516562
  • Filename
    1516562