Title :
800MHz∼2.5GHz miniaturized multi-layer symmetrical stacked baluns for silicon based RF ICs
Author :
Kaixue Ma ; Jianguo Ma ; Lin Jia ; BengHwee Ong ; Kiat Seng Yeo ; Manh Anh Do
Author_Institution :
Center for Integrated Circuits & Syst., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
A miniaturized multi-layer symmetrical stacked balun designed and fabricated in a commercial CMOS technology are presented. The measured performance of the compensated single-ended drive balun, in good agreement with simulation, covers the frequency range of 800MHz∼2.5GHz with the amplitude mismatching less than 0.4dB and phase errors less than 3.2 degrees. The die size of the balun is only 270μm×270μm.
Keywords :
CMOS integrated circuits; UHF integrated circuits; baluns; silicon; CMOS technology; RF IC; Si; amplitude mismatch; multi-layer symmetrical stacked balun; passive balun; phase errors; radiofrequency integrated circuits; single-ended drive balun; CMOS process; CMOS technology; Costs; Impedance matching; Inductors; Integrated circuit technology; Radio frequency; Silicon; Spirals; Wireless communication;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1516581
