DocumentCode
2151276
Title
Fast and optimized task allocation method for low vertical link density 3-Dimensional Networks-on-Chip based many core systems
Author
Ying, Haoyuan ; Hollstein, Thomas ; Hofmann, Klaus
Author_Institution
Integrated Electronic Systems Lab, TU Darmstadt, Germany
fYear
2013
fDate
18-22 March 2013
Firstpage
1777
Lastpage
1782
Abstract
The advantages of moving from 2-Dimensional Networks-on-Chip (NoCs) to 3-Dimensional NoCs for any application must be justified by the improvements in performance, power, latency and the overall system costs, especially the cost of Through-Silicon-Via (TSV). The trade-off between the number of TSVs and the 3D NoCs system performance becomes one of the most critical design issues. In this paper, we present a fast and optimized task allocation method for low vertical link density (TSV number) 3D NoCs based many core systems, in comparison to the classic methods as Genetic Algorithm (GA) and Simulated Annealing (SA), our method can save quite a number of design time. We take several state-of-the-art benchmarks and the generic scalable pseudo application (GSPA) with different network scales to simulate the achieved design (by our method), in comparison to GA and SA methods achieved designs, our technique can achieve better performance and lower cost. All the experiments have been done in GSNOC framework (written in SystemC-RTL), which can achieve the cycle accuracy and good flexibility.
Keywords
Bandwidth; Biological cells; Genetic algorithms; Resource management; System performance; Three-dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location
Grenoble, France
ISSN
1530-1591
Print_ISBN
978-1-4673-5071-6
Type
conf
DOI
10.7873/DATE.2013.357
Filename
6513803
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