SMT solder paste deposit inspection based on 3D PMP and 2D image features fusion

Author

Luo, Bing ; Zhang, Li-yun

Author_Institution

Inf. Sch., Wuyi Univ., Jiangmen, China

fYear

2010

fDate

11-14 July 2010

Firstpage

190

Lastpage

194

Abstract

Defects inspection for solder paste deposit in PCB SMT assembly can depress final fault rate and save rework cost. The solder paste deposit inspection needs both 2D analysis and 3D volume measurement. Conventional methods suffered slow speed and low reliability. This paper proposed inspecting by grating projection phase shifting profilometry 3D scale fusion with 2D image features, which help phase measuring and unwrapping as well as shadows processing. Experimental results show that the approach is fast, accurate and reliable.

Keywords

image fusion; inspection; printed circuits; solders; surface mount technology; 2D analysis; 2D image features fusion; 3D PMP; 3D volume measurement; PCB SMT assembly; SMT solder paste deposit inspection; defects inspection; grating projection phase shifting profilometry 3D scale fusion; Distortion measurement; Inspection; Machine vision; Measurement by laser beam; Phase measurement; Pixel; Three dimensional displays; Information fusion; Phase shifting profilometry; Phase unwrapping; Solder paste inspection; Surface mounted technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Wavelet Analysis and Pattern Recognition (ICWAPR), 2010 International Conference on

Conference_Location

Qingdao

Print_ISBN

978-1-4244-6530-9

Type

conf

DOI

10.1109/ICWAPR.2010.5576321

Filename

5576321