• DocumentCode
    2151871
  • Title

    A New Low Cost Packaging Technique for SMT Insertion of Millimeter MMICs

  • Author

    Cachier, Gérard

  • Author_Institution
    Thomson - CSF Communications, 66, rue du Fossé Blanc. BP 136. 92231 Gennevilliers Cedex, France. eMail: gerard.cachier@tcc.thomson-csf.com
  • Volume
    3
  • fYear
    1999
  • fDate
    Oct. 1999
  • Firstpage
    386
  • Lastpage
    389
  • Abstract
    The newly developed package "MUSE" has a low insertion loss, and is free of any parasitic resonance up to around 50 Ghz. It enables low cost SMT insertion of millimeter MMICs on microwave PC boards, together with the non-microwave components.
  • Keywords
    Bonding; Costs; MMICs; Microstrip; Microwave devices; Packaging machines; Protection; Resonance; Semiconductor device measurement; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1999. 29th European
  • Conference_Location
    Munich, Germany
  • Type

    conf

  • DOI
    10.1109/EUMA.1999.338473
  • Filename
    4139633
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2151871