Evaluation and Measurements of Parasitic Coupling in Metallic Package in MIC and MMICS

This paper presents a study of parasitic coupling in a metallic enclosure among microstrip discontinuities in MIC and MMICs. Metallic enclosure support several modes which modify the coupling between various parts of the circuit and consequently, alter the circuit performance. Computed and measured results of parasitic coupling in a metllic enclosure among microstrip discontinuities are presented in this article. This paper presents a convenient method to evaluate the effects of packages on parasitic coupling among microstrip discontinuities. The proposed method has been applied to evaluate spurious coupling between microstrip discontinuities in a metallic enclosure. A significant reduction in computation time, compared to other Em programs. has been obtained bv employing the proposed method. Results based on the proposed method are compared with experimental results and also with full-wave analysis results. The computed results are in fair agreement with measured results.