DocumentCode
2151962
Title
Neuro-stimulus chip with photodiodes array for sub-retinal implants
Author
Zhang, Xu ; Pei, Weihua ; Huang, Beiju ; Chen, HongDa
Author_Institution
Inst. of Semicond., Chinese Acad. of Sci., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
1757
Lastpage
1760
Abstract
A prototype neuro-stimulus chip for sub-retinal implants in blind patients affected by age-related macular degeneration (AMD) or retinitis pigmentosa (RP) is presented in this paper. This retinal prosthetic chip was designed to replace the degenerated photoreceptor cells, and in order to stimulate directly the remaining healthy layers of retinal neurons. The current stimulus circuits are monolithic integrated with photodiodes (PD) array, which can convert the illumination on the eyes into bi-phasic electrical pulses. In addition, a novel charge cancellation circuit is used to discharge the electrodes for medical safety.The prototype chip is designed and fabricated in HJTC 0.18 ¿m N-well CMOS 1P6M Mix-signal process, with a ± 2.5 V dual voltage power supply.
Keywords
CMOS integrated circuits; bioelectric phenomena; biomedical electrodes; biomedical electronics; cellular biophysics; diseases; eye; health and safety; integrated circuit design; neurophysiology; photodiodes; prosthetics; vision defects; AMD; HJTC; N-well CMOS 1P6M mix-signal process; RP; age-related macular degeneration; bi-phasic electrical pulse; blind patients; charge cancellation circuit; current stimulus circuits; degenerated photoreceptor cells; dual voltage power supply; electrode discharge; eye disease; medical safety; monolithic integrated photodiode array; prototype neuro-stimulus chip fabrication; retinal neuron layers; retinal prosthetic chip design; retinitis pigmentosa; size 0.18 mum; sub-retinal implants; Circuits; Implants; Neurons; Partial discharges; Photodiodes; Photoreceptors; Pigmentation; Prosthetics; Prototypes; Retina;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734894
Filename
4734894
Link To Document