DocumentCode
2151990
Title
W-Band Micromachined Vertical Interconnection for Three-Dimensional Microwave ICs
Author
Henick, Katherine J. ; Yook, Jong-Gwan ; Robertson, Stephen V. ; Rebeiz, Gabriel M. ; Katehi, Linda P B
Author_Institution
The Radiation Laboratory, Electrical Engineering and Computer Science Department, The University of Michigan, Ann Arbor, MI 48109-2122, USA
Volume
3
fYear
1999
fDate
Oct. 1999
Firstpage
402
Lastpage
406
Abstract
A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only 0.6 dB. This transition uses standard processing techniques and is a compact, 520 ¿m width and 520 ¿m length, design. With this vertical interconnect, multiple IC layers may be connected to achieve new levels of high density, low loss integration.
Keywords
Conductors; Etching; Fabrication; Frequency; Gold; Integrated circuit interconnections; Micromachining; Microwave filters; Millimeter wave technology; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1999. 29th European
Conference_Location
Munich, Germany
Type
conf
DOI
10.1109/EUMA.1999.338477
Filename
4139637
Link To Document