DocumentCode :
2152623
Title :
A C-band AlGaN/GaN HEMT with Cat-CVD SiN passivation developed for an over 100 W operation
Author :
Kamo, Yoshitaka ; Kunii, T. ; Takeuchi, H. ; Yamamoto, Yusaku ; Totsuka, M. ; Shiga, Toshikazu ; Minami, Hisataka ; Kitano, Toshihiko ; Miyakuni, S. ; Oku, Takanori ; Inoue, Akira ; Matsuda, Yuuki ; Ishikawa, Takaaki ; Nanjo, T. ; Chiba, Hidetoshi ; Suita
Author_Institution :
High Frequency & Opt. Device Works, Mitsubishi Electr. Corp., Itami, Japan
fYear :
2005
fDate :
12-17 June 2005
Abstract :
We applied a Cat-CVD (catalytic chemical vapor deposition) passivation film to AlGaN/GaN HEMTs, to resolve the trade-off between their drain current transient time and gate-drain break down voltage. We did not employ any field plate because it degrades high frequency operation over C-band. The SiN passivation film, deposited after a NH3 treatment, resulted in less transient time and less gate leakage current than conventional PE-CVD passivation. A T-shaped gate HEMT fabricated by this technique, with Lg = 0.4 μm and Wg = 50.4 mm, delivered an output power over 140 W (2.79 W/mm), which was a record power at C-band.
Keywords :
III-V semiconductors; aluminium compounds; catalysis; chemical vapour deposition; gallium compounds; high electron mobility transistors; leakage currents; passivation; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; 0.4 micron; 50.4 mm; AlGaN-GaN; C-band HEMT; Cat-CVD passivation; T-shaped gate HEMT; catalytic chemical vapor deposition; drain current transient time; gate leakage current; gate-drain breakdown voltage; Aluminum gallium nitride; Chemical vapor deposition; Degradation; Frequency; Gallium nitride; HEMTs; Leakage current; Passivation; Silicon compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
ISSN :
01490-645X
Print_ISBN :
0-7803-8845-3
Type :
conf
DOI :
10.1109/MWSYM.2005.1516638
Filename :
1516638
Link To Document :
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