New intelligent power module for electric vehicles

Author

Nakajima, Toshihiro ; Yoshida, Shigekazu ; Uenishi, Akio ; Shirasawa, Takaaki ; Ukita, Susumu ; Kimura, Yoshio

Author_Institution

Mitsubishi Electr. Corp., Fukuoka City, Japan

Volume

2

fYear

1995

fDate

8-12 Oct 1995

Firstpage

954

Abstract

A new intelligent power module (IPM) of 450 A, 600 V has been developed. There are three major aspects in IPM development: IGBT (insulated gate bipolar transistor) device technology, packaging technology, and intelligent driver and protection circuits technology. The IGBT device has low power loss and high switching speed. The packaging has a smart housing with special easy-to-use connectors and high density mounting. The developed circuits constitute a three phase inverter bridge, driver and three protection functions (short-circuit, over-temperature, and control supply under-voltage lock) in addition to a serially-coded fault output function. Furthermore, reliability and cost are important factors for electric vehicles. This paper describes the structure and the superior electric characteristics of the new IPM

Keywords

PWM invertors; automotive electronics; bipolar transistor switches; driver circuits; electric vehicles; insulated gate bipolar transistors; overvoltage protection; power bipolar transistors; power field effect transistors; power semiconductor switches; protection; semiconductor device packaging; 450 A; 600 V; IGBT; control supply under-voltage lock protection; cost; electric vehicles; high density mounting; high switching speed; insulated gate bipolar transistor; intelligent driver circuit; intelligent power module; intelligent protection circuitry; low power loss; over-temperature protection; packaging; protection circuits technology; reliability; serially-coded fault output function; short-circuit protection; three phase inverter bridge; Bridge circuits; Connectors; Driver circuits; Electric vehicles; Insulated gate bipolar transistors; Intelligent vehicles; Inverters; Multichip modules; Packaging; Protection;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE

Conference_Location

Orlando, FL

ISSN

0197-2618

Print_ISBN

0-7803-3008-0

Type

conf

DOI

10.1109/IAS.1995.530403

Filename

530403