Title :
Integral power net integrity analysis of a packaged u-Controller system including the u-Controller on-chip power net distribution
Author :
Miersch, Ekkehard ; Goekcen, Mehmet ; Steinecke, Thomas
Author_Institution :
EFM Consulting, Schoenaich
Abstract :
In this paper an application of Integral Analysis Techniques is demonstrated for determining the effect of large simultaneously switching IC Circuit Groups (internal IC-Circuits and I/O´s ) on their Power Integrity (PI) and I/O-Signal Integrity (I/O-SI) behavior. The analysis includes the complex Packaging (CP+PCB). A large u-Controller and its wire-bonded Chip-Package(CP) plus its Test-PCB have been used for our study, which is in this paper focused on the analysis of Conducted Power Emission Noise in Frequency- and Time-Domain (FD, TD). The FD-power analysis results are shown in comparison with related Spectrum Analyzer measurements. The methodology can analogously be applied to conducted I/O Signal Noise. The achieved short CPU run times and the ease-of- use are underlined.
Keywords :
electronics packaging; frequency-domain analysis; integrated circuit noise; microcontrollers; system-on-chip; time-domain analysis; PCB; conducted power emission noise; frequency-domain analysis; input-output signal integrity; mu-Controller on-chip; packaged mu-Controller system; power integrity; power net distribution; simultaneously switching IC circuit groups; spectrum analyzer; time-domain analysis; wire bonded chip-package; Analytical models; Circuit noise; Integrated circuit noise; Integrated circuit packaging; Power distribution; Power system simulation; Spectral analysis; Switching circuits; System-on-a-chip; Voltage;
Conference_Titel :
Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
Conference_Location :
Strasbourg
Print_ISBN :
978-1-4244-4490-8
Electronic_ISBN :
978-1-4244-4489-2
DOI :
10.1109/SPI.2009.5089866
