Title :
Minimisation of P surface segregation during epitaxial silicon growth for the fabrication of a silicon-based quantum computer
Author :
Oberbeck, L. ; Curson, N.J. ; Hallam, T. ; Simmons, M.Y. ; Goh, K. E I ; Schofield, S.R. ; Ruess, F.J. ; Clark, R.G.
Author_Institution :
Centre for Quantum Comput. Technol., New South Wales Univ., Sydney, NSW, Australia
Abstract :
To optimise the fabrication process for a silicon based quantum computer the surface segregation/diffusion of phosphorus atoms in silicon is investigated on an atomic scale using scanning tunnelling microscopy (STM) after epitaxial silicon growth at 255 °C and room temperature, respectively. The phosphorus atom in the Si(001) surface forms a silicon-phosphorus heterodimer identified as a bright zigzag feature in filled state STM images. Sample annealing, used to reduce the surface roughness and the defect density after silicon growth is shown to increase the density of phosphorus atoms at the surface. However, the density of phosphorus atoms can be limited to a few percent of the initial density if the phosphorus atoms are encapsulated in silicon at room temperature.
Keywords :
annealing; crystal defects; elemental semiconductors; epitaxial growth; optical computing; phosphorus; quantum computing; scanning tunnelling microscopy; semiconductor epitaxial layers; silicon; surface diffusion; surface roughness; surface segregation; 25 degC; 255 degC; P; P surface segregation; STM; Si; Si(001) surface; bright zigzag feature; defect density; diffusion; epitaxial silicon growth; fabrication process; phosphorus atoms; room temperature; sample annealing; scanning tunnelling microscopy; silicon-based quantum computer fabrication; silicon-phosphorus heterodimer; surface roughness; Annealing; Atomic layer deposition; Fabrication; Microscopy; Quantum computing; Rough surfaces; Silicon; Surface roughness; Temperature; Tunneling;
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on
Print_ISBN :
0-7803-7571-8
DOI :
10.1109/COMMAD.2002.1237241