Title :
Numerical optimization of a heat sink used for electric motor drives
Author :
Gordon, M.H. ; Stewart, M.B. ; King, B. ; Balda, J.C. ; Olejniczak, K.J.
Author_Institution :
Dept. of Mech. Eng., Arkansas Univ., Fayetteville, AR, USA
Abstract :
To maximize the performance of a finned heat sink used to cool power modules for motor drives rated up to five horsepower, fluid and thermal effects were modeled using the commercially available software packages ANSYS and FLUENT. In particular, a heat sink used to cool a power module with an average power dissipation of 203 Watts was numerically studied to assess the feasibility of using the same heat sink to cool a power module with an average power dissipation of 265 Watts. Results indicate that, if the geometric configuration is unchanged, the volumetric flow rate must be increased by nearly 65%-increasing the pressure drop by 250% and the required fan power by 410%-or the ambient temperature must be lowered by almost 15°C, relative to the base case
Keywords :
cooling; digital simulation; electronic engineering computing; heat sinks; modules; motor drives; optimisation; power electronics; semiconductor device packaging; simulation; thermal analysis; 203 W; 265 W; ANSYS software package; FLUENT software package; average power dissipation; cooling; electric motor drives; fan power increase; finned heat sink; fluid effects; geometric configuration; numerical optimization; performance maximisation; pressure drop; thermal effects; volumetric flow rate; Diodes; Electric motors; Heat sinks; Heat transfer; Motor drives; Multichip modules; Power dissipation; Resistance heating; Shape; Temperature;
Conference_Titel :
Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3008-0
DOI :
10.1109/IAS.1995.530405