DocumentCode
2154512
Title
Low-loss waveguide fabrication using inductively coupled argon plasma enhanced quantum well intermixing in InP quantum well sample
Author
Mei, T. ; Djie, H.S. ; Sookdhis, C. ; Arokiaraj, I.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fYear
2002
fDate
11-13 Dec. 2002
Firstpage
311
Lastpage
314
Abstract
The inductively coupled plasma enhanced quantum well intermixing (ICP-QWI) technology has been well established for tuning the bandgap of quantum well structure using argon plasma. This technology provides effective bandgap tuning capability (e.g., with quantum well bandgap shift as large as 104 nm in quantum well laser structure in InP substrate [1]), which is competent for implementing photonic integration. A differential bandgap shift of 86 nm with very small differential linewidth broadening of ∼3 Å was obtained by applying selective intermixing using SiO2 mask layer. Photonics integration capability was demonstrated by the fabrication of the broad area extended cavity lasers and the fabricated passive waveguide has a measured loss of 2.98 cm-1.
Keywords
III-V semiconductors; energy gap; indium compounds; integrated optics; laser cavity resonators; optical fabrication; optical losses; optical waveguides; plasma materials processing; quantum well lasers; semiconductor quantum wells; silicon compounds; InGaAs-InGaAsP; InP; InP quantum well sample; InP substrate; SiO2; SiO2 mask layer; argon plasma; bandgap tuning capability; broad area extended cavity lasers; differential bandgap shift; differential linewidth broadening; inductively coupled argon plasma enhanced quantum well intermixing; low-loss waveguide fabrication; passive waveguide; photonic integration; quantum well laser structure; selective intermixing; Area measurement; Argon; Indium phosphide; Laser tuning; Loss measurement; Optical device fabrication; Photonic band gap; Plasma waves; Quantum well lasers; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on
ISSN
1097-2137
Print_ISBN
0-7803-7571-8
Type
conf
DOI
10.1109/COMMAD.2002.1237253
Filename
1237253
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