DocumentCode :
2154670
Title :
Fabrication of p-channel BICFET in the Ge/sub x/Si/sub 1-x//Si system
Author :
Taft, R.C. ; Plummer, James D.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1988
fDate :
11-14 Dec. 1988
Firstpage :
570
Lastpage :
573
Abstract :
The first operational BICFET (bipolar-inversion-channel field-effect transistor) structures based on the Ge/sub x/Si/sub 1-x//Si system have been demonstrated. The 300 K current gains of beta >300 are believed to be the highest values reported for a BICFET in any material system to date. The device structure, fabrication, and electrical performance are presented. It is concluded that due to its small vertical dimensions and ability to scale laterally, this device shows promise for both discrete and VLSI high-speed applications.<>
Keywords :
Ge-Si alloys; elemental semiconductors; field effect transistors; heterojunction bipolar transistors; integrated circuit technology; molecular beam epitaxial growth; semiconductor epitaxial layers; semiconductor junctions; semiconductor materials; semiconductor technology; silicon; 300 K; BICFET; Ge/sub x/Si/sub 1-x/-Si; bipolar-inversion-channel field-effect transistor; current gains; device structure; electrical performance; fabrication; scaling; small vertical dimensions; Computer simulation; Conducting materials; Doping profiles; FETs; Fabrication; Molecular beam epitaxial growth; Photonic band gap; Silicon; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1988.32879
Filename :
32879
Link To Document :
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