• DocumentCode
    2154755
  • Title

    Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging

  • Author

    Monfraix, P. ; Adam, T. ; Lacoste, J.L. ; Drevon, C. ; Naudy, G. ; Cogo, B. ; Cazaux, J.L. ; Roux, J.L.

  • Author_Institution
    ALCATEL SPACE INDUSTRIES, 26 avenue J.F. CHAMPOLLION, 31037 TOULOUSE CEDEX, France. Tel: +33 (0)5 34 35 60 70, Fax: +33 (0)5 34 35 69-47, E-mail: Philippe.Monfraix@space.alcatel.fr
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the electrical design, measurement and reliability tests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [¿55°C, +125°C] temperature range.
  • Keywords
    Chip scale packaging; Electric variables measurement; Electromagnetic measurements; Electromagnetic shielding; Insertion loss; Manufacturing; Microwave measurements; Semiconductor device measurement; Testing; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338747
  • Filename
    4139760
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2154755