Title :
A Multilayer Integration Technique for Low-loss, Low-crosstalk Interconnects and Circuits for RF Silicon MMICs
Author :
DeVincentis, Marc ; Kim, Juno ; Qian, Yongxi ; Feng, Guojin ; Ma, Pingxi ; Chang, M.Frank ; Itoh, Tatsuo
Author_Institution :
Electrical Engineering Department, University of California, Los Angeles, Los Angeles, CA 90095-1594, USA. Phone: (310)206-1024, Fax: (310)206-4819, Email: marcd@ee.ucla.edu
Abstract :
This paper reports our latest progress in developing the Silicon/Metal/Polyimide (SIMPOL) architecture for high-performance RF interconnects. This 3D MMIC process utilizes polyimide for an interlayer dielectric on low-resistivity CMOS-grade silicon substrates. The SIMPOL structure exhibits low noise-crosstalk (<¿80dB up to 18GHz and <¿40dB up to 50GHz) along with excellent insertion loss (<¿0.25dB/mm up to 45GHz). A branch line coupler was implemented and a bandpass filter was designed at 37 GHz using the SIMPOL process. The results demonstrate the multilayer capability, superior performance, and applicability of SIMPOL to advanced millimeter-wave wireless communication systems.
Keywords :
Band pass filters; Circuit noise; Dielectric substrates; Insertion loss; Integrated circuit interconnections; MMICs; Nonhomogeneous media; Polyimides; Radio frequency; Silicon;
Conference_Titel :
Microwave Conference, 2000. 30th European
Conference_Location :
Paris, France
DOI :
10.1109/EUMA.2000.338760
