DocumentCode
2155067
Title
Layout proximity effects and device extraction in circuit designs
Author
Lin, Xi-Wei
Author_Institution
Silicon Eng. Group, Mountain View, CA, USA
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
2228
Lastpage
2231
Abstract
The scaling of CMOS technology intensifies the interaction between design and process at 45nm or below, causing strong layout-dependent proximity effects. Photolithography, strain silicon engineering, and ion implantation are the primary causes of those effects, whose impacts to design can be mitigated via restrictive design rules and accurate modeling. A novel approach is proposed that seamlessly integrates physical models with geometry processing for device extraction, alleviating the overheads to LVS and circuit simulators in conventional design flow.
Keywords
CMOS integrated circuits; integrated circuit design; ion implantation; photolithography; proximity effect (lithography); semiconductor doping; CMOS; circuit designs; device extraction; ion implantation; layout proximity effects; photolithography; strain silicon engineering; CMOS process; CMOS technology; Capacitive sensors; Circuit synthesis; Design engineering; Lithography; Process design; Proximity effect; Silicon; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4735020
Filename
4735020
Link To Document