• DocumentCode
    2155067
  • Title

    Layout proximity effects and device extraction in circuit designs

  • Author

    Lin, Xi-Wei

  • Author_Institution
    Silicon Eng. Group, Mountain View, CA, USA
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    2228
  • Lastpage
    2231
  • Abstract
    The scaling of CMOS technology intensifies the interaction between design and process at 45nm or below, causing strong layout-dependent proximity effects. Photolithography, strain silicon engineering, and ion implantation are the primary causes of those effects, whose impacts to design can be mitigated via restrictive design rules and accurate modeling. A novel approach is proposed that seamlessly integrates physical models with geometry processing for device extraction, alleviating the overheads to LVS and circuit simulators in conventional design flow.
  • Keywords
    CMOS integrated circuits; integrated circuit design; ion implantation; photolithography; proximity effect (lithography); semiconductor doping; CMOS; circuit designs; device extraction; ion implantation; layout proximity effects; photolithography; strain silicon engineering; CMOS process; CMOS technology; Capacitive sensors; Circuit synthesis; Design engineering; Lithography; Process design; Proximity effect; Silicon; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4735020
  • Filename
    4735020