• DocumentCode
    2155221
  • Title

    BCDRouter: Global routing considering CMP and via reduction

  • Author

    Liang, Jinghong ; Hong, Xianlong ; Jing, Tong

  • Author_Institution
    Comput. Sci. & Technol. Dept., Tsinghua Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    2284
  • Lastpage
    2287
  • Abstract
    Chemical-mechanical polishing (CMP) is one of the fundamental problems that should be considered for improving design for manufacturability (DFM) in routing. This paper presents a global routing algorithm, which is BCDRouter, to consider CMP. The algorithm uses the routing density of GRC to simulate the density of CMP, and reduces routing and congestion densities simultaneously. This will make the continuous CMP plainer. So that DFM, reliability and yield can be improved. The experimental results show that the algorithm is effective in reducing maximum GRC congestion and congestion variance.
  • Keywords
    chemical mechanical polishing; network routing; reduction (chemical); BCDRouter; CMP; chemical-mechanical polishing; global routing; reliability; via reduction; Algorithm design and analysis; Chemical technology; Design for manufacture; Minimization; Routing; Semiconductor device manufacture; System-on-a-chip; Transistors; Ultra large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4735026
  • Filename
    4735026