DocumentCode
2155221
Title
BCDRouter: Global routing considering CMP and via reduction
Author
Liang, Jinghong ; Hong, Xianlong ; Jing, Tong
Author_Institution
Comput. Sci. & Technol. Dept., Tsinghua Univ., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
2284
Lastpage
2287
Abstract
Chemical-mechanical polishing (CMP) is one of the fundamental problems that should be considered for improving design for manufacturability (DFM) in routing. This paper presents a global routing algorithm, which is BCDRouter, to consider CMP. The algorithm uses the routing density of GRC to simulate the density of CMP, and reduces routing and congestion densities simultaneously. This will make the continuous CMP plainer. So that DFM, reliability and yield can be improved. The experimental results show that the algorithm is effective in reducing maximum GRC congestion and congestion variance.
Keywords
chemical mechanical polishing; network routing; reduction (chemical); BCDRouter; CMP; chemical-mechanical polishing; global routing; reliability; via reduction; Algorithm design and analysis; Chemical technology; Design for manufacture; Minimization; Routing; Semiconductor device manufacture; System-on-a-chip; Transistors; Ultra large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4735026
Filename
4735026
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