DocumentCode
2155298
Title
A dielectrically-supported multi-element mass flow sensor
Author
Yoon, E. ; Wise, K.D.
Author_Institution
Solid-State Electron. Lab., Michigan Univ., Ann Arbor, MI, USA
fYear
1988
fDate
11-14 Dec. 1988
Firstpage
670
Lastpage
673
Abstract
The author reports a monolithic transducer array for measuring the physical variables associated with gas flow up to 8 m/s. The transducers are supported on micromachined dielectric windows and measure flow velocity, flow direction, ambient gas temperature, and ambient pressure. The gas velocity sensor is based on a full-diaphragm structure and for a 1-mm*1-mm window achieves an output voltage of 34 mV/V at 5 m/s flow velocity in air with an input heater power of 13.9 mW. The polysilicon pressure sensor has a sensitivity of 12 p.p.m./mm Hg and operates over a range of more than 800 mm Hg. Generic thermal models have been developed to describe the electrothermal characteristics of the planar diaphragm structure and to optimize the device designs. The process requires seven masks, and the overall die size is 3 mm*4.5 mm.<>
Keywords
electric sensing devices; flow measurement; flowmeters; integrated circuit technology; monolithic integrated circuits; pressure transducers; thermometers; transducers; velocity measurement; 0 to 8 m/s; 0 to 800 mmHg; 1 mm; 13.9 mW; 4.5 mm; ambient gas temperature; ambient pressure; device designs; dielectrically-supported multi-element mass flow sensor; electrothermal characteristics; flow direction; flow velocity; full-diaphragm structure; gas flow; gas velocity sensor; heater power; integrated mass flow sensor; micromachined dielectric windows; monolithic transducer array; overall die size; planar diaphragm structure; pressure sensor; Dielectric measurements; Fluid flow; Fluid flow measurement; Gas detectors; Mercury (metals); Pressure measurement; Temperature sensors; Thermal sensors; Transducers; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1988.32902
Filename
32902
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