Title :
Broadband dual-via architectures for multilayer PCB signal injection and intra-layer transition
Author :
Metz, Carsten ; Baras, Torben ; Lyons, Alan
Author_Institution :
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
Abstract :
In this paper two transmission line architectures for intra-layer transitions in multilayer printed circuit boards (PCBs) are presented. Based on a balanced power divider and combiner concept, these can significantly improve the broadband transmission behavior for transmission rates beyond 10GB/s. The electrical performance for state-of-the-art PCBs is reviewed, and compared to the approach by means of simulations and measurements.
Keywords :
microstrip transitions; power combiners; power dividers; printed circuit design; balanced power divider; broadband dual-via architectures; broadband transmission behavior; electrical performance; intra-layer transition; multilayer PCB; multilayer printed circuit boards; power combiner; signal injection; state-of-the-art PCB; stub resonance; transmission line architectures; Backplanes; Dielectric substrates; Distributed parameter circuits; Frequency; High speed optical techniques; Nonhomogeneous media; Power transmission lines; Printed circuits; Resonance; Stripline;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1516752
