Title :
UV-LIGA metal MEMS: A promising tool to serve IC industry
Author :
Gu, Lei ; Wu, Zhengzheng ; Wang, Fei ; Cheng, Rong ; Jiang, Kewei ; Li, Xinxin
Author_Institution :
State key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
Abstract :
Metal MEMS structures can be formed by metal electroplating with the aid of thick-photoresist molds. The microfabrication features low-temperature process that is post-CMOS compatible and can be used for on-chip integration of high-performance RF parrives for RFICs. On the other hand, The plating process can be combined with silicon micromachining techniques to build operation tools, like probe-cards, for wafer-level IC testing. The presentation addresses the promising techniques and achievements in device prototypes.
Keywords :
CMOS integrated circuits; LIGA; electroplating; micromachining; micromechanical devices; CMOS; UV-LIGA; electroplating; metal MEMS; microfabrication; silicon micromachining; Circuit testing; Copper; Inductors; Integrated circuit testing; Metals industry; Micromachining; Micromechanical devices; Radio frequency; Radiofrequency integrated circuits; Silicon;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735052
