Title :
Numerical simulation of silicon micro flat heat pipes with axial triangle grooves
Author :
Chao, Wang ; Xiaowei, Liu ; Mingxue, Huo ; Lei, Xu
Author_Institution :
MEMS Center, Harbin Inst. of Technol., Harbin, China
Abstract :
One-dimensional model is developed and solved numerically to investigate the flow of liquid and vapor in triangle grooves. The effect of liquid and vapor interfacial shear stress is taken into account in this model that can greatly improve the accuracy of the results. The results obtained from this simulation contain behaviors of pressure and flow patterns, the effect of different working conditions and so forth. In addition, maximum heat transport capacity of micro heat pipe is calculated. The model predicted results are successfully compared with the experimental results from the published results in literature. The general nature of the model and the associated parametric study ensure the wide applicability of the model.
Keywords :
heat pipes; numerical analysis; plastic flow; shear strength; silicon; thermal analysis; axial triangle grooves; liquid flow investigation; liquid-vapor interfacial shear stress; numerical simulation; pressure-flow patterns; silicon micro flat heat pipes; Atmospheric modeling; Equations; Fluid flow; Heat pumps; Heat transfer; Numerical simulation; Silicon; Steady-state; Stress; Thermal conductivity; maximum heat transport capacity; micro groove; numerical simulation; silicon micro flat heat pipe;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735055
