DocumentCode
2156185
Title
Polymeric optical interconnection on OEIC chips for future 100-Gbit/s class O/E packages
Author
Aratake, Atsushi ; Akeyoshi, Tomoyuki ; Tokumitsu, Masami
Author_Institution
NTT Photonics Laboratories, NTT Corp., Kanagawa, Japan
fYear
2002
fDate
11-13 Dec. 2002
Firstpage
571
Lastpage
574
Abstract
We propose a monolithically-integrated polymeric optical waveguide with a micro-mirror that makes it significantly easier to construct photoreceiver modules. It is possible to shrink the spot-size of the incident beam by curving the mirror, which yields much lower insertion loss compared to flat mirrors. The location and shape of the mirror can be easily controlled by common photolithographic techniques. Using a prototype waveguide, the total insertion loss for the interconnect of a single-mode fiber (SMF) to a 9-μm (23-μm) diameter PD was reduced to 3.8 (1.6) dB.
Keywords
integrated optoelectronics; micromirrors; monolithic integrated circuits; optical couplers; optical fabrication; optical fibre communication; optical interconnections; optical losses; optical polymers; optical receivers; optical waveguides; photolithography; 1.6 dB; 100 Gbit/s; 23 mum; 3.8 dB; 9 mum; OEIC chips; beam size; insertion loss; micromirror; monolithic integration; photolithographic techniques; photoreceiver; polymeric optical interconnection; polymeric optical waveguide; single-mode fiber; Insertion loss; Mirrors; Optical interconnections; Optical losses; Optical polymers; Optical waveguides; Optoelectronic devices; Packaging; Prototypes; Shape control;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on
ISSN
1097-2137
Print_ISBN
0-7803-7571-8
Type
conf
DOI
10.1109/COMMAD.2002.1237316
Filename
1237316
Link To Document