• DocumentCode
    2156277
  • Title

    BioMEMS Summer Bioengineering Institute: Integrating engineering and biology education through BioMEMS design, fabrication, and test

  • Author

    Perez-Castillejos, Raquel ; Hunter, William C. ; Mantilla, B. ; Ivanov, Dentcho

  • fYear
    2012
  • fDate
    9-9 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The Department of Biomedical Engineering at the New Jersey Institute of Technology (NJIT) developed a BioMEMS Summer Bioengineering Institute. The focus on BioMEMS was supported by both didactic and research activities planned for the students. The research experience consisted on (i) designing and (Ii) fabricating a BioMEMS device in the Class-10 Cleanroom of the Microelectronics Facility at the New Jersey Institute of Technology, and finally (iii) testing their device in a host biomedical research lab either in the University Heights (Newark, NJ) academic community, the metropolitan New York community (an easy commute), or at their home university. The students´ research experience was complemented by four formal courses: three on biomedical engineering (bioelectrical signals, physiologic modeling, and imaging; biomechanics, tissue engineering, and biomaterials; biochemistry and cell biology from an engineering point of view) and a fourth one on BioMEMS.
  • Keywords
    bioMEMS; educational institutions; electronic engineering education; microfabrication; BioMEMS Summer Bioengineering Institute; BioMEMS design; BioMEMS fabrication; Department of Biomedical Engineering; NJIT; New Jersey Institute of Technology; University Heights; biochemistry; bioelectrical signals; biology education; biomaterials; biomechanics; cell biology; physiologic modeling; tissue engineering; Biology; Biomedical engineering; Educational institutions; Fabrication; Medical diagnostic imaging; BioMEMS; biomedical engineering; design-based education; interdisciplinary;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated STEM Education Conference (ISEC), 2012 IEEE 2nd
  • Conference_Location
    Ewing, NJ
  • Print_ISBN
    978-1-4673-1097-0
  • Type

    conf

  • DOI
    10.1109/ISECon.2012.6204178
  • Filename
    6204178