Title :
Numerical Investigation of Flip Chip Connections using FDTD Simulations
Author :
Starski, J. Piotr ; Rudnicki, Janusz
Author_Institution :
Chalmers University of Technology, Microwave Electronics, 412 96 Göteborg, Sweden. Email: piotr@ep.chalmers.se
Abstract :
In this paper we present computer simulations for interconnections between a CPW transmission line and a CPW chip (CPW-CPW), Fig. 1, and between a CPW transmission line and a microstrip chip with the active surface turned upwards from the mother board (CPW-MS), Fig. 3. The location of the bumps and the use of multiple bumps are investigated for both interconnection types.
Keywords :
Computational modeling; Computer simulation; Coplanar waveguides; Finite difference methods; Flip chip; Integrated circuit interconnections; Microstrip; Strips; Time domain analysis; Transmission lines;
Conference_Titel :
Microwave Conference, 2000. 30th European
Conference_Location :
Paris, France
DOI :
10.1109/EUMA.2000.338805
