Title :
W-band flip-chip VCO in thin-film environment
Author :
Schmückle, F.J. ; Lenk, F. ; Hutter, M. ; Klein, M. ; Oppermann, H. ; Engelmann, G. ; Töpper, M. ; Riepe, K. ; Heinrich, W.
Abstract :
A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme.
Keywords :
III-V semiconductors; MMIC oscillators; bipolar MMIC; elemental semiconductors; flip-chip devices; gallium arsenide; heterojunction bipolar transistors; silicon; thin film circuits; voltage-controlled oscillators; 77 GHz; GaAs-Si; MMIC oscillators; W-band voltage controlled oscillator; flip-chip packaging; flip-chip voltage controlled oscillator; heterojunction bipolar transistor; thin-film environment; thin-film structures; Frequency; Gallium arsenide; Gold; MMICs; Packaging; Semiconductor thin films; Substrates; Tin; Transistors; Voltage-controlled oscillators;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1516837
