DocumentCode
2156700
Title
Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices
Author
Lee, Yung-Chun ; Chen, Chun-Hung ; Chen, Hsueh-Liang ; Liu, Chin-Hsin ; Chiu, Cheng-Yu ; Lin, Hung-Yi
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
2456
Lastpage
2459
Abstract
In this paper, two types of contact-printing methods for micro/nano-lithography are developed and their application on fabricating high-frequency surface acoustic wave (SAW) devices are investigated. First of all, a light-assisted metal film patterning (LAMP) method which transfers a patterned metal film directly from a silicon mold to a substrate is discussed. The pattern transformation relies on both mechanical contact pressure and optical heating at the interface. Metal patterns with 100 nm feature size can be easily transferred in laboratory using simple equipments. Secondly, a contact-transfer and mask-embedded lithography (CMEL) is proposed which cleverly arranges pure mechanical forces and surface energy difference to achieve the patterning of nano-structures on various kinds of substrates. Applications of these two developed methods are demonstrated on the fabrication of high-frequency (~2 GHz) surface acoustic wave (SAW) filters and resonators. Future developments and potential applications of these nanoimprinting and nano-patterning methods will be addressed.
Keywords
masks; mechanical contact; nanolithography; nanopatterning; surface acoustic wave devices; SAW devices; contact printing method; contact-transfer lithography; high-frequency surface acoustic wave devices fabrication; light-assisted metal film patterning method; mask-embedded lithography; mechanical contact pressure; mechanical force; microlithography; nanolithography; nanopatterning methods; optical heating; resonators; surface energy; Acoustic waves; Nanoscale devices; Optical films; Optical resonators; Optical surface waves; Printing; Semiconductor films; Substrates; Surface acoustic wave devices; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4735086
Filename
4735086
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