The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver

Author

Song, Sangsub ; Kim, Sungwon ; Yeon, Sungjin ; Park, Sangho ; Lee, Ju-Yong ; Lee, Sanghyo ; Choi, Wooyeol ; Kwon, Youngwoo ; Seo, Kwang-Seok

fYear

2005

fDate

12-17 June 2005

Abstract

We present novel multi-chip module (MCM)-D technology to improve the mechanical and thermal properties of a MCM-D substrate for a motherboard of the flip-chip structure. Advantages of the flip-chip mounted MMIC technology using the modified MCM-D substrate were investigated. Based on this investigation, the W-band CPW MMIC amplifier using the 0.1-μm GaAs pHEMT was successfully mounted on the modified MCM-D substrate by means of the flip-chip technology. Moreover, the W-band down-converter module with internal local oscillator (LO) source was realized with this technology.

Keywords

HEMT integrated circuits; III-V semiconductors; MMIC amplifiers; coplanar waveguides; flip-chip devices; gallium arsenide; transceivers; 0.1 micron; GaAs; MCM-D substrate; MMIC amplifier; W-band amplifier; W-band down-converter module; W-band transceiver; coplanar waveguide amplifier; flip-chip mounted MMIC technology; local oscillator; multichip module technology; pHEMT; Coplanar waveguides; Dielectric substrates; Dielectric thin films; MMICs; Packaging; Radio frequency; Silicon; Thermal conductivity; Thermal expansion; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2005 IEEE MTT-S International

ISSN

01490-645X

Print_ISBN

0-7803-8845-3

Type

conf

DOI

10.1109/MWSYM.2005.1516838

Filename

1516838