Title :
Application oriented MEMS by open collaboration
Author :
Esashi, Masayoshi
Author_Institution :
World Premier Int. Res. Center Adv. Inst. for Mater. Res., Tohoku Univ. Sendai, Sendai, Japan
Abstract :
Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described. MEMS which use non-silicon materials as diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
Keywords :
carbon nanotubes; ceramic packaging; electron beam lithography; gyroscopes; lithium compounds; micromechanical devices; microsensors; microswitches; optical scanners; silicon compounds; surface acoustic wave sensors; 2D optical scanner; CNT; LTCC; LiNbO3; MEMS switch; SAW wireless passive sensor; Si; SiC; application oriented MEMS; carbon nanotube; diamond; electrostatically levitated rotational gyroscope; glass press molding; integrated capacitive pressure sensor; multi-column electron beam lithography system; multi-probe data storage; nonsilicon materials; probe card; silicon MEMS; silicon carbide; wafer level packaged devices; wafer-level burn-in test; Collaboration; Electron optics; Gyroscopes; Integrated optics; Micromechanical devices; Optical devices; Optical sensors; Sensor phenomena and characterization; Silicon carbide; Wafer scale integration;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4735114
