DocumentCode :
2157631
Title :
FireBird: PowerPC e200 based SoC for high temperature operation
Author :
Cojbasic, Radisav ; Cogal, Omer ; Meinerzhagen, Pascal ; Senning, Christian ; Slater, Catherine ; Maeder, Thomas ; Burg, Andreas ; Leblebici, Yusuf
Author_Institution :
Microelectron. Syst. Lab. (LSM), Swiss Fed. Inst. of Technol. Lausanne (EPFL), Lausanne, Switzerland
fYear :
2013
fDate :
22-25 Sept. 2013
Firstpage :
1
Lastpage :
4
Abstract :
PowerPC Architecture microcontrollers are commonly used in embedded applications. In this work we present FireBird, the first PowerPC based SoC for reliable operation beyond 200°C. Designing SoCs for reliable operation at high temperatures is a significant challenge, due to increased static leakage current, reduced carrier mobility, and increased electro-migration. To alleviate the consequences of high temperatures, this paper proposes to customize a PowerPC e200 based SoC by using a dynamically reconfigurable clock frequency, exhaustive clock gating, and electromigration-resistant power supply rings. A 20×9 mm2 chip implementing this design has been fabricated in 0.35 μm CMOS technology. The custom testing procedure showed the expected maximum operating frequency reduction from 38MHz at room-temperature to 30 MHz at 200°C, which illustrates the importance of an adaptable clock frequency under temperature variation. At 200°C, the maximum power dissipation at 3.3 V supply voltage was 1.2W and the idle state static leakage current was 3.4 mA. Silicon measurements proved that this design outperforms PowerPC based SoCs available in the high-temperature microcontrollers market which are not operational at temperatures above 125°C.
Keywords :
CMOS digital integrated circuits; carrier mobility; clocks; leakage currents; microcontrollers; power supply circuits; system-on-chip; CMOS technology; FireBird; PowerPC architecture; PowerPC e200; SoC; current 3.4 mA; dynamically reconfigurable clock frequency; electromigration-resistant power supply rings; embedded applications; exhaustive clock gating; high temperature operation; high-temperature microcontrollers market; power 1.2 W; reduced carrier mobility; silicon measurements; size 0.35 mum; static leakage current; temperature 200 degC; temperature 293 K to 298 K; voltage 3.3 V; Clocks; Ports (Computers); Power demand; Random access memory; Read only memory; System-on-chip; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2013 IEEE
Conference_Location :
San Jose, CA
Type :
conf
DOI :
10.1109/CICC.2013.6658519
Filename :
6658519
Link To Document :
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