• DocumentCode
    2157722
  • Title

    Extracting interconnect capacitance sensitivity to linewidth variation

  • Author

    Huang, Nick ; Labun, Andrew

  • Author_Institution
    Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC
  • fYear
    2009
  • fDate
    3-6 May 2009
  • Firstpage
    185
  • Lastpage
    189
  • Abstract
    VLSI interconnect capacitance is becoming more significant and also increasingly subject to process variation. A simple technique to extract from layout the sensitivity of interconnect parasitic capacitance to linewidth process variations is proposed based on 2.5 D capacitance models and implemented in the Magic VLSI layout editor. The derivative of each extracted capacitance with respect to variation in every level is obtained. Coincident edges in layout result in distinct ldquoshrinkingrdquo and ldquobloatingrdquo derivatives. The derivatives form a gradient that may be multiplied by a vector of the variations on each level to give the total expected deviation from nominal capacitance. The gradient allows the process sensitivity of each capacitance to be determined by simply inspecting the netlist.
  • Keywords
    VLSI; integrated circuit interconnections; integrated circuit layout; VLSI layout; interconnect capacitance sensitivity; linewidth variation; process variation; very large scale integration; Capacitance measurement; Cleaning; Conductors; Dielectrics; Etching; Geometry; IEEE members; Parasitic capacitance; Shape; Very large scale integration; Interconnect; capacitance extraction; process variation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2009. CCECE '09. Canadian Conference on
  • Conference_Location
    St. John´s, NL
  • ISSN
    0840-7789
  • Print_ISBN
    978-1-4244-3509-8
  • Electronic_ISBN
    0840-7789
  • Type

    conf

  • DOI
    10.1109/CCECE.2009.5090117
  • Filename
    5090117