DocumentCode
2157722
Title
Extracting interconnect capacitance sensitivity to linewidth variation
Author
Huang, Nick ; Labun, Andrew
Author_Institution
Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC
fYear
2009
fDate
3-6 May 2009
Firstpage
185
Lastpage
189
Abstract
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process variation. A simple technique to extract from layout the sensitivity of interconnect parasitic capacitance to linewidth process variations is proposed based on 2.5 D capacitance models and implemented in the Magic VLSI layout editor. The derivative of each extracted capacitance with respect to variation in every level is obtained. Coincident edges in layout result in distinct ldquoshrinkingrdquo and ldquobloatingrdquo derivatives. The derivatives form a gradient that may be multiplied by a vector of the variations on each level to give the total expected deviation from nominal capacitance. The gradient allows the process sensitivity of each capacitance to be determined by simply inspecting the netlist.
Keywords
VLSI; integrated circuit interconnections; integrated circuit layout; VLSI layout; interconnect capacitance sensitivity; linewidth variation; process variation; very large scale integration; Capacitance measurement; Cleaning; Conductors; Dielectrics; Etching; Geometry; IEEE members; Parasitic capacitance; Shape; Very large scale integration; Interconnect; capacitance extraction; process variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Computer Engineering, 2009. CCECE '09. Canadian Conference on
Conference_Location
St. John´s, NL
ISSN
0840-7789
Print_ISBN
978-1-4244-3509-8
Electronic_ISBN
0840-7789
Type
conf
DOI
10.1109/CCECE.2009.5090117
Filename
5090117
Link To Document