• DocumentCode
    2158536
  • Title

    Next Generation Packaging Architectures for Highly Integrated Wireless Systems

  • Author

    Laskar, J. ; Tentzeris, M. ; Sutono, A. ; Liang, H. ; Bushyager, N. ; Lim, K.

  • Author_Institution
    Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present the development and characterization of three critical technologies for wireless communication packaging architectures. In this paper, we include the design, implementation and measurement results of embedded components for multi-chip-modules (MCM) and micromachined planar antennas. In addition, an optimized digital Pin Grid Array (PGA) package has been built and demonstrates suitable application for wireless packaging architectures.
  • Keywords
    Antenna measurements; Capacitors; Circuit testing; Computer architecture; Dielectric substrates; Electronics packaging; Microstrip; Pins; Resonator filters; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338891
  • Filename
    4139904
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2158536