Title :
Next Generation Packaging Architectures for Highly Integrated Wireless Systems
Author :
Laskar, J. ; Tentzeris, M. ; Sutono, A. ; Liang, H. ; Bushyager, N. ; Lim, K.
Author_Institution :
Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
Abstract :
We present the development and characterization of three critical technologies for wireless communication packaging architectures. In this paper, we include the design, implementation and measurement results of embedded components for multi-chip-modules (MCM) and micromachined planar antennas. In addition, an optimized digital Pin Grid Array (PGA) package has been built and demonstrates suitable application for wireless packaging architectures.
Keywords :
Antenna measurements; Capacitors; Circuit testing; Computer architecture; Dielectric substrates; Electronics packaging; Microstrip; Pins; Resonator filters; Topology;
Conference_Titel :
Microwave Conference, 2000. 30th European
Conference_Location :
Paris, France
DOI :
10.1109/EUMA.2000.338891
