• DocumentCode
    2159418
  • Title

    Influence of Advanced GaAs MMICs on Structure and Cost of High Frequency TR-Modules for Communication and Radar Systems for Volume Markets

  • Author

    Daembkes, H. ; Quentin, P. ; Camiade, M. ; Beilenhoff, K. ; Adelseck, B. ; Schickl, O. ; Schroth, J. ; Viaud, J.P. ; Lajugie, M. ; Chapelle, P. ; Turin, M.

  • Author_Institution
    United Monolithic Semiconductors, Orsay, France and Ulm, Germany
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper the impact of advanced GaAs MMIC design and fabrication on the cost structure of today´s RF modules for the commercial mass market will be discussed. The emerging new generation of multifunction MMICs will lead to a higher integration scheme in parallel with a significant reduction of total chip area. Moreover, the reduction of assembly efforts together with new mounting concepts will allow a further decrease of module cost. In this paper the different trends will be listed and discussed both qualitatively and quantitatively. Some examples for current developments will be given as well.
  • Keywords
    Assembly; Bit rate; Costs; Fabrication; Gallium arsenide; MMICs; Manufacturing; Mobile communication; Radar; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338603
  • Filename
    4139938