Title :
Improvement the NOC Bandwidth and fault Tolerant by Multipath routing in three-dimensional topologies for multi-media applications
Author :
Rad, Mohammad Reza Nouri ; Kourdy, Reza ; Nasab, Majid Rahimi ; Poyan, Mohammad
Author_Institution :
Arak Branch, Dept.of Comput. Eng., Islamic Azad Univ., Arak, Iran
Abstract :
As CMOS technology scales down into the deep submicron (DSM) domain, devices and interconnects are subject to new types of malfunctions and failures that are harder to predict and avoid with the current system-on-chip (SoC) design methodologies. We propose a combination of a topology and Multi-path routing which can increase fault-Tolerant and Communication load which is suitable for multimedia applications. We compare the performance of Fat-Tree, 2d-Mesh and 3d-Mesh architectures using Multi-path routing in the sense of on chip network design methodology. The simulations of each of the architectures are done with IP and Multi-path routing, two-dimensional and three-dimensional topologies. We also carry out the high level simulation of on chip network using NS-2 to verify the analytical analysis.
Keywords :
CMOS integrated circuits; fault tolerant computing; integrated circuit design; multimedia computing; network routing; network topology; network-on-chip; 2D-mesh architecture; 3D topology; 3D-mesh architecture; CMOS technology; IP routing; NOC bandwidth; NS-2; communication load; deep submicron domain; fat-tree architecture; fault tolerant; multimedia application; multipath routing; on chip network design methodology; system-on-chip design methodology; three-dimensional topology; two-dimensional topology; Bandwidth; Chip scale packaging; Circuit faults; Computational modeling; Fault tolerance; Network-on-a-chip; Object oriented modeling; Routing; System-on-a-chip; Topology; 3D-Mesh NoC; Bandwidth utilization; Fault Tolerance; Network-on-Chip; retargetable simulation;
Conference_Titel :
Computer and Automation Engineering (ICCAE), 2010 The 2nd International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5585-0
Electronic_ISBN :
978-1-4244-5586-7
DOI :
10.1109/ICCAE.2010.5451627