Title :
Multi-dimensional model reduction of VLSI interconnects
Author :
Gunupudi, Pavan ; Nakhla, Michel
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Abstract :
Recently there have been numerous publications for developing reduced-order macromodels for linear circuits. However, all these techniques perform model reduction with respect to a single parameter such as frequency. This paper presents a new technique to reduce the order of the linear system simultaneously with respect to multiple parameters. The reduction is based on multidimensional congruence transformation. The proposed algorithm provides efficient means to estimate the response of large circuits simultaneously as a function of frequency and other design parameters
Keywords :
VLSI; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; network parameters; reduced order systems; VLSI interconnects; design parameters; large circuits; linear system; multi-dimensional model reduction; multidimensional congruence transformation; multiple parameters; reduced-order macromodels; Circuit simulation; Computer networks; Ear; Equations; Frequency estimation; Integrated circuit interconnections; Linear systems; Reduced order systems; Very large scale integration; Voltage;
Conference_Titel :
Custom Integrated Circuits Conference, 2000. CICC. Proceedings of the IEEE 2000
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-5809-0
DOI :
10.1109/CICC.2000.852717