• DocumentCode
    2160154
  • Title

    A novel high-performance predictable circuit architecture for the deep sub-micron era

  • Author

    Im, Yonghee ; Roy, Kaushik

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    503
  • Lastpage
    506
  • Abstract
    Current VLSI design techniques focus on four major goals: higher integration, faster speed, lower power, and shorter time-to-market. Those goals have been accomplished mainly by deep sub-micron technology along with voltage scaling. However, scaling down feature size causes larger interwire capacitance which is responsible for large crosstalk between concerned interconnects. We are currently facing signal integrity problems never experienced before, such that accurate function predictability of circuits under certain input conditions may be questionable, not to mention performance and power dissipation predictability. In this paper we suggest a novel predictable circuit architecture, named optimized overlaying array based architecture (O2ABA), especially suited for the deep sub-micron regime. O 2ABA achieves reduction of crosstalk by considering the current directions and by reducing interwire capacitance. The introduction of unit cell leads to high regularity, which makes the performance predictable even before layout, and shortens time-to-design. O2ABA is compared with other design styles, such as custom design, PLA and Weinberger array, to show its advantages
  • Keywords
    VLSI; capacitance; crosstalk; integrated circuit design; low-power electronics; PLA; VLSI design techniques; Weinberger array; crosstalk; current directions; custom design; deep sub-micron era; feature size; function predictability; interwire capacitance; low power electronics; optimized overlaying array based architecture; power dissipation; predictable circuit architecture; signal integrity problems; speed; time-to-design; time-to-market; voltage scaling; CMOS logic circuits; Capacitance; Circuit noise; Dynamic voltage scaling; Energy consumption; Integrated circuit interconnections; Power dissipation; Time to market; Very large scale integration; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2000. CICC. Proceedings of the IEEE 2000
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-5809-0
  • Type

    conf

  • DOI
    10.1109/CICC.2000.852718
  • Filename
    852718