Title :
A novel double-side heat-removing laser structure for very high efficiency and high power lasers
Author :
Ji, Xiaoming ; Choa, Fow-Sen
Author_Institution :
Maryland Univ., Baltimore, MD, USA
Abstract :
Thermal design is known to be very important in high-power opto-electronic packaging. Efficient heat removing arrangement can greatly improve the device performance including the maximum output power, which is closely related to the junction and heat sink temperature difference, and the device lifetime, which strongly depends on the built-in thermal stress. A novel double-side heat-removing structure is proposed to reduce the junction and the heat sink temperature difference to a few degree K. Theoretic analysis and simulation results are presented.
Keywords :
heat sinks; packaging; semiconductor junctions; semiconductor lasers; thermal stresses; thermo-optical effects; built-in thermal stress; device lifetime; device performance; double-side laser structure; heat sink temperature difference; heat-removing laser structure; high efficiency lasers; high power lasers; junction temperature difference; optoelectronic packaging; semiconductor lasers; thermal design; Heat sinks; Optical losses; Power lasers; Radiative recombination; Semiconductor lasers; Temperature; Thermal conductivity; Thermal expansion; Thermal resistance; Thermal stresses;
Conference_Titel :
Lightwave Technologies in Instrumentation and Measurement Conference, 2004. Proceedings of the
Print_ISBN :
0-7803-8722-8
DOI :
10.1109/LTIMC.2004.1370983
